Lub nti ntawm lub rooj tsavxwm (ChipOnBoard, COB) txheej txheem: ua ntej, siv cov thermally conductive epoxy resin (feem ntau yog ib qho epoxy resin doped nrog cov nyiaj hais) ntawm lub substrate nto los npog cov silicon nti qhov chaw tso chaw, thiab ces cov silicon nti txuas thiab muab tso rau. Nyob rau saum npoo ntawm substrate, kev kho cua sov kom txog rau thaum cov qauv ntawm silicon wafer tau teem rau ntawm lub substrate, thiab tom qab ntawd siv cov txheej txheem ntawm tus tswv lo lo ntxhuav los txhaj tsib qhov hluav taws xob sib txuas ntawm silicon wafer thiab substrate.
Lu chip technology feem ntau muaj ob hom. Ib qho yog COB thev naus laus zis, thiab lwm qhov yog inverted nti thev naus laus zis. Chip-on-board ntim (COB). Lub semiconductor nti yog mounted rau ntawm lub rooj tsavxwm luam tawm. Kev sib txuas hluav taws xob ntawm cov nti thiab cov substrate yog stitched. Cov txheej txheem yog siv, thiab cov resin sov npog yog siv los xyuas kom meej nws kev ntseeg tau. Txawm hais tias COB yog ib qho yooj yim barley nti mounting thev naus laus zis, nws qhov ntim ntim yog qhov qis dua rau TAB thiab flip-chip bonding technology.
The welding method of COB
(1) Kub nias kab
Siv British cua sov thiab siab ua kom cov hlau thiab vuam cheeb tsam nias ua ke. Lub hauv paus ntsiab lus yog ua kom lub chaw faib (xws li AI) yas deform los ntawm cua sov thiab siab, thiab tib lub sij hawm rhuav tshem cov oxide huab ntawm lub sculpting interface, thiaj li hais tias qhov attraction ntawm lub atoms yog tiav, thiab lub hom phiaj ntawm [GG. ] quot; khi 7" ua tiav. Uh, qhov tsis sib xws nyob rau sab nraud ntawm ob lub hlau tuaj yeem ua rau cov hlau sab saud thiab qis hauv ib leeg thaum lawv rhuab thiab nias. Cov thev naus laus zis no feem ntau yog siv los ua COG rau cov chips ntawm lub iav board.
⑵) Kev ntsuam xyuas Ultrasound
Ultrasonic Huan siv lub zog pawg tsim los ntawm lub sijhawm ultrasonic, thiab tom qab ntawd los ntawm lub zog hloov pauv, nyob rau hauv qhov induction ntawm ultra-high zaus magnetic teb, qhov nthuav dav sai thiab contraction ua rau elastic npog txav, kom Nus riam yog correspondingly resisted. , thiab nyob rau tib lub sij hawm, Nu riam A tej yam ntawm lub siab yog ntxiv rau saum toj no, yog li nyob rau hauv kev sib koom ua ke ntawm ob lub zog, riam yuav tsav cov huab metalized ntawm AI hlau nyob rau hauv lub mourning cheeb tsam, xws li (AI pancreas) surging nto sai sai, yog li ntawd lub A hlau Thiab AI zaj duab xis nres nto tsim cov yas deformation, qhov deformation no tseem yuav rhuav tshem cov huab cua oxide ntawm AI huab interface, kom ob qhov chaw hlau ntshiab yog nyob ze kom ua tiav. kev sib raug zoo ntawm atoms, yog li tsim ib qho kev sib txuas. Cov khoom siv tseem ceeb rau kev sib txuas kab nuv ntses yog aluminium hlau vuam taub hau, feem ntau nyob rau hauv cov duab ntawm cov nyom.
(3) Kub hlau p
Pob kev quaj ntsuag yog ib qho ntawm cov cuab yeej siv hluav taws xob hnyav tshaj plaws ntawm cov hlau sib txuas, vim tias tam sim no semiconductor diode thiab triode ntim tag nrho siv AU hlau pob. Tsis tas li ntawd, nws txoj haujlwm yooj yim dua thiab hloov pauv tau, thiab cov pob qij txha yog qhov ruaj khov (qhov vuam lub zog ntawm AU hlau nrog txoj kab uas hla ntawm 25UM feem ntau yog 0.07 ~ 0.09N cov ntsiab lus), thiab nws tsis muaj kev taw qhia, thiab vuam ceev. tuaj yeem ncav cuag ntau dua 15 cov ntsiab lus ib ob. Kub hlau bait kuj hu ua thermal (siab) (ultra) acoustic bait. Cov khoom sib txuas tseem ceeb yog kub (AU) hlau. Lub taub hau yog spherical, yog li nws tseem hu ua pob mourning.
